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South Korean additive manufacturing company LincSolution has launched a three-year international research project to develop mass-production technology for 3D printed heat pump components, targeting entry into the AI data center cooling and electric vehicle thermal management markets.
The project, called “Development of Next-Generation Heat Pump Miniaturization Technology,” runs from July 2026 through June 2029 and is backed by the Energy Technology Leadership International Joint Research project, which is supported by the Korea Institute of Energy Technology Evaluation and Planning (KETEP). Total funding for the effort comes to 3.4 billion won.
Chung-Ang University is the lead organizing institution. Joining LincSolution on the project are Kookmin University, the Korea Institute of Mach