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3D Printed Electronics Specialist APES Joins Great Lakes Semiconductor’s First Innovation Funnel Project

3D Printed Electronics Specialist APES Joins Great Lakes Semiconductor’s First Innovation Funnel Project

Quick Summary

• Since Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) announced a strategic partnership earlier this year, I’ve been looking forward to hearing more about the collaboration, which the...

Additional Context

Since Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) announced a strategic partnership earlier this year, I’ve been looking forward to hearing more about the collaboration, which the two companies announced would rev up in Q3. The work appears to be right on schedule, with GLS now announcing that it has launched the first project on its Great American ChipForge platform, a project that APES will be an integral part of.

The earlier announcement stated that this is when GLS and APES would begin co-locating operations in Fishkill, NY, and that they’d start with a project focused on the automotive market. The first project will indeed address the auto market, specifically AI-enabled vehicle sensors. In addition to GLS and APES, five other companies will be pa

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